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| MBRS230LT3 Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package . . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. http://onsemi.com * * * * * * * * * * * * Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Maximum Temperature of 260C/10 Seconds for Soldering Available in 12 mm Tape, 2500 Units per 13 Reel, Add "T3" Suffix to Part Number Cathode Polarity Band Marking: 2BL3 SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 30 VOLTS Mechanical Characteristics: SMB CASE 403A PLASTIC MARKING DIAGRAM YWW 2BL3 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 110C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 105C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM Value 30 Unit V Y = Year WW= Work Week 2BL3 = Specific Device Code 2.0 4.0 A A ORDERING INFORMATION Device MBRS230LT3 Package SMB Shipping 2500/Tape & Reel IFSM 40 A Tstg, TC TJ dv/dt -55 to +175 -55 to +125 10,000 C C V/ms (c) Semiconductor Components Industries, LLC, 2003 1 April, 2003 - Rev. 2 Publication Order Number: MBRS230LT3/D MBRS230LT3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance - Junction-to-Lead (Note 1) Thermal Resistance - Junction-to-Ambient (Note 1) Symbol RJL RJA Value 18.6 135 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) see Figure 2 Maximum Instantaneous Reverse Current (Note 2) see Figure 4 (VR = 30 V) (VR = 15 V) (IF = 2.0 A) (IF = 4.0 A) IR VF TJ = 25C 0.50 0.60 TJ = 25C 1 0.31 TJ = 125C 0.45 0.63 TJ = 125C 75 35 mA Volts 1. Minimum pad size (0.108 X 0.085) for each lead on FR4 board. 2. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%. IF, INSTANTANEOUS FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 10 1 1 TJ = 125C 0.1 TJ = 125C 100C 25C -55 C 100C 25C 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E-3 IR, REVERSE CURRENT (AMPS) TJ = 125C TJ = 100C 1E-3 IR, MAXIMUM REVERSE CURRENT (AMPS) 100E-3 TJ = 125C TJ = 100C 10E-3 10E-3 1E-3 100E-6 TJ = 25C 10E-6 1E-6 0 5 10 100E-6 TJ = 25C 10E-6 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRS230LT3 IO, AVERAGE FORWARD CURRENT (AMPS) 3.5 dc 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 140 TC, CASE TEMPERATURE (C) SQUARE WAVE Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 Ipk/Io = 20 FREQ = 20 kHz PFO, AVERAGE POWER DISSIPATION (WATTS) 1.8 dc 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IO, AVERAGE FORWARD CURRENT (AMPS) TJ = 125C Ipk/Io = 20 Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 SQUARE WAVE Figure 5. Current Derating Per Leg Figure 6. Forward Power Dissipation Per Leg r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1 RqJ Lead = 18.6 0.1 RqJ Ambient = 150 0.01 0.001 0.0001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0 10 100 1000 Figure 7. Thermal Response http://onsemi.com 3 MBRS230LT3 MINIMUM SOLDER PAD SIZES 0.089 2.261 0.108 2.743 inches mm 0.085 2.159 PACKAGE DIMENSIONS S A SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. D B C INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 K P J H ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 4 MBRS230LT3/D |
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